We present TPLEC, a layout decomposition for triple patterning lithography with end-cutting.
SPIE’13 benchmarks: GDSII format ASCII format
Bei Yu, Jhih-Rong Gao and David Z. Pan, “Triple-patterning lithography (TPL) layout decomposition using end-cutting”, SPIE Intl. Symp. Advanced Lithography, San Jose, CA, Feb. 24–28, 2013.
Bei Yu, Subhendu Roy, Jhih-Rong Gao and David Z. Pan, “Triple-patterning lithography (TPL) layout decomposition using end-cutting”, Journal of Micro/Nanolithography, MEMS, and MOEMS (JM3), vol.14, no.1, 011002, 2015.
TPLEC-Decomposer is developed by Bei Yu, Subhendu Roy, and Prof. David Z. Pan. Please contact us with any bug reports and comments.